발명의명칭: 플렉서블 전자 소자 제작을 위한 전사 장비 및 이를 이용한 전사 방법(transferring and packaging apparatus for fabricating flexible electronic device)
Int. CI: H01L 21/67 (2006.01.01) H01L 51/56 (2006.01.01) H01L 51/00 (2006.01.01)
출원번호(일자): 1020170125063 (2017.09.27)

Transfer and packaging equipment according to the present invention includes a hollow process chamber; a base plate disposed in the process chamber; a moving module disposed on the base plate; a stage module movably arranged in a state parallel to the ground by the moving module; and an optical controller movably disposed on the upper portion of the stage module in a spaced apart state; and a transfer substrate adsorption unit disposed on the upper side of the stage module to be liftable, and a target substrate mounted on any one of a plurality of stages constituting the stage module and mounted on the transfer substrate adsorption unit. The transfer substrate is transferred using any one of a plurality of protocols including stamping, ACF, SOCF, and UV methods.